Action
Futures perpétuels Taiwan Semiconductor Manufacturing (TWSE shares) (TSMC)
Futures perpétuels TSMC sur 3 plateformes crypto – prix du perp vs l'action, taux de funding, open interest et où trader TSMCUSDT.
Taiwan Semiconductor Manufacturing (TSMC) produit des circuits intégrés et des dispositifs à semi-conducteurs, avec fabrication de wafers, assemblage, tests et distribution mondiale pour mobile, informatique, automobile et IoT.
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Données de trading
Activité du marché perpétuel
3/3 marchés en direct
Données de trading
Activité du marché perpétuel
Performance spot
Matrice des plateformes
3 marchés
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| Trader | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MEXC | Trader | TSMC/USDT | En négociation | $72,50 | 0,0 % APR 0,000 % toutes les 8h | +37,2 bps | 692,8 k $ | 171,5 k $ | 485,3 k $ | USDT | 20x | |
 Bitget | Trader | TWTSM/USDT | En négociation | $72,51 | 0,0 % APR 0,000 % toutes les 8h | +37,2 bps | 364,9 k $ | 67,3 k $ | 23,8 k $ | USDT | 20x | |
 Ourbit | Trader | TSMC/USDT | En négociation | $72,52 | 0,0 % APR 0,000 % toutes les 8h | +139,3 bps | 118,2 k $ | 2,1 M $⚠ | 151,2 k $ | USDT | 20x |
Volume non vérifié : disproportionné par rapport à l'intérêt ouvert, signe typique de wash trading. Ces plateformes sont listées en dernier.
Négociabilité
Qualité d'exécution
Coût d'entrée et profondeur par plateforme de $1k à $100k
Négociabilité
Qualité d'exécution
Coût d'entrée et profondeur par plateforme de $1k à $100kLiquidité mince · 2 des 3 plateformes absorbent $10k · Coût typique: +26,3 bps – +27,5 bps
Exécution la moins chère: MEXC · +25,6 bps
Pas de carnet récent: Ourbit
Estimation d'exécution taker avec frais approx. - les fills maker ne sont pas garantis.
Meilleures plateformes pour ce sous-jacent
Meilleure liquidité
TSMCSpread le plus serré
TSMCVolume le plus élevé
TSMCHistorique du financement
Instantanés de plateformes enregistrés par marché
Historique du financement
Instantanés de plateformes enregistrés par marchéProchain catalyseur
Catalyseurs
Prochain catalyseur
Catalyseurs
Aucune activité perp inhabituelle actuellement.
Données de recherche
Analystes, documents et contexte des pairs
Données de recherche
Analystes, documents et contexte des pairs
Estimations
6Événements de l'entreprise
6Comparaison avec les pairs
Perpétuels cotés similairesMix de revenus
Dernier annuelAnalystes
Objectifs de coursHistorique des avis d'analystes
NotesActionnariat
Institutionnel · 2026-Q3Activité du marché de référence
TSMC-PERPPerformance du cours
11Activité des initiés
Aucune donnée d'initié disponible.Dépôts
100 · Derniers dépôts SECTranscriptions
Conférences de résultatsFY2026 Q32026-10-15
Conférences de résultats
Résumé IA
positiveTSMC reported Q3 2026 revenue of $46.7 billion, up 16.2% sequentially in USD and above the high end of guidance, on strong leading-edge demand. Gross margin was 66.4%, down 1.3 points sequentially mainly from 2nm ramp dilution; operating margin was 58.7% and EPS TWD 29.43. HPC rose 22% sequentially to 68% of revenue; 2nm was 8% of wafer revenue and advanced nodes 79%. Q4 revenue is guided to $52.3–54.3 billion (14% sequential, 58% year-over-year at midpoint), with gross margin 65–67% and operating margin 56.5–58.5%, reflecting continued 2nm and overseas fab dilution. Management expects full-year 2026 revenue growth around 44% in USD and reiterated a $60–64 billion 2026 capital budget, with 2026–2028 CapEx significantly higher than the prior three years. N2 annual capacity is expected to more than double in 2027; new 3nm fabs are planned in Tainan and Arizona, and A14 risk production is on track for 2027 with volume in 2028. Management said AI demand is extremely robust and still exceeds supply, while being prudent on 2027 planning given consumer and price-sensitive segment pressure.
Points clés
- Q3 revenue of $46.7 billion came in above the high end of USD guidance, up 16.2% sequentially; full-year 2026 growth is now expected around 44% year-over-year in USD.
- 2nm contributed 8% of Q3 wafer revenue; the N2 family's annual capacity is expected to more than double in 2027 on smartphone and HPC/AI demand.
- HPC rose 22% sequentially to 68% of revenue; advanced technologies (7nm and below) were 79% of wafer revenue.
- Management said AI demand is extremely robust and remains above TSMC's ability to supply, citing agentic AI and open-source AI models as drivers; the narrow AI accelerator CAGR definition excludes CPUs.
- TSMC is expanding at an unprecedented pace with nearly 20 fabs in progress, including an additional 3nm fab in Tainan and Arizona 3nm volume production in Q3 2027, slightly ahead of schedule.
Faits financiers
- Q3 2026 revenue: $46.7 billion, up 16.2% sequentially in USD and up 17.6% sequentially in NT dollars.
- Q3 gross margin 66.4%, down 1.3 percentage points sequentially due to 2nm ramp dilution; operating margin 58.7%; EPS TWD 29.43; ROE 45.5%.
- Q3 revenue by node: 2nm 8%, 3nm 33%, 5nm 28%, 7nm 10% of wafer revenue; advanced technologies 79%.
- Q3 platform mix: HPC 68% (up 22% sequentially), smartphone 21% (up 10%), IoT 4% (up 5%), automotive 4% (up 23%), DCE 1% (down 12%).
Perspectives
- Q4 2026 revenue guided to $52.3–54.3 billion, a 14% sequential increase or 58% year-over-year increase at the midpoint.
- Q4 gross margin guided to 65–67% and operating margin to 56.5–58.5%, based on USD/TWD exchange rate of 31.8.
- Full-year 2026 revenue growth expected around 44% year-over-year in USD terms.
- Full-year 2026 capital budget reiterated at $60–64 billion; CapEx from 2026 to 2028 expected to be significantly higher than the past three years.
Thèmes Q&A
- Capacity planning versus AI demand: management said demand exceeds supply and cited a disciplined top-down and bottom-up process, including checks on data center build-out and U.S. power supply.
- Overseas expansion: Arizona 3nm volume production moved to Q3 2027; TSMC is evaluating a Texas site and discussing use of a customer's Terafab capacity, with any fab to be run by TSMC.
- Advanced packaging: management said TSMC is in volume production at 5x reticle size with excellent yield, is working on 9x and 14x, and said CoWoS remains customers' number-one choice.
- Pricing and margins: pricing is described as strategic and varying by segment, location and technology; overseas fab dilution is expected at 3–4 points in the latter part of the five-year period.
Risques
- Consumer and price-sensitive end markets are being challenged by rising component prices and macroeconomic uncertainty, prompting prudent planning for 2027.
- Gross margin dilution from the steep 2nm ramp and overseas fabs continues; overseas fab dilution is expected to widen to 3–4% in the next few years.
- Tool supply is tight and tool price inflation is real, alongside material and labor cost pressure, while demand and capacity growth remain hard to forecast.
FY2026 Q22026-07-16
Conférences de résultats
Résumé IA
positiveTSMC reported Q2 2026 revenue of $40.2 billion at the high end of guidance, driven by strong demand for leading-edge process technologies. HPC increased 20% quarter-over-quarter to 66% of revenue, while smartphone declined 4% to 22%. Gross margin rose 150 basis points sequentially to 67.7%, slightly ahead of guidance. For Q3 2026, TSMC guides revenue of $44.6-45.8 billion (12% sequential, 37% year-over-year growth at the midpoint), with gross margin of 65%-67% and operating margin of 56%-58%. The company raised its full-year 2026 capital budget to $60-$64 billion and now expects FY2026 revenue growth slightly above 40% year-over-year in U.S. dollar terms, citing extremely robust AI demand. Management announced an additional $100 billion investment in Arizona for 2 nm and below fabs plus advanced packaging, and detailed progress on N2, A14 and mature-node strategies.
Points clés
- Q2 2026 revenue was $40.2 billion at the high end of guidance, driven by strong demand for leading-edge process technologies.
- HPC grew 20% quarter-over-quarter to 66% of Q2 revenue; smartphone declined 4% to 22%.
- Full-year 2026 revenue growth is now expected to be slightly above 40% year-over-year in U.S. dollar terms.
- 2026 capital budget was raised to $60 billion-$64 billion to support customer growth, including emerging agentic AI demand.
- TSMC announced an additional $100 billion investment in Arizona, adding roughly four more fabs including 2 nm and below technologies and advanced packaging.
Faits financiers
- Q2 2026 gross margin increased 150 basis points sequentially to 67.7%, slightly ahead of guidance on cost improvements and higher capacity utilization, partially offset by overseas fab dilution.
- Advanced technology (7 nm and below) accounted for 77% of Q2 wafer revenue; 2 nm contributed 3%, 3 nm 30%, 5 nm 33% and 7 nm 11%.
- Q2 capital expenditures totaled $15.7 billion; cash from operations was about TWD 783 billion.
- Q3 2026 gross margin is guided to decrease 1.7 percentage points to 66% at the midpoint, primarily due to about 3-4 percentage points of dilution from the steep 2 nm ramp.
Perspectives
- Q3 2026 revenue guided to $44.6 billion-$45.8 billion, a 12% sequential and 37% year-over-year increase at the midpoint, based on a $1 to TWD 32 exchange rate assumption.
- Q3 2026 gross margin guided to 65%-67% and operating margin to 56%-58%.
- Full-year 2026 revenue growth expected to be slightly above 40% year-over-year in U.S. dollar terms.
- Full-year 2026 capital budget raised to $60 billion-$64 billion, with about 70%-80% for advanced process technologies and about 10%-20% for advanced packaging, testing, mask making and others.
Thèmes Q&A
- Capital expenditure plans and the absence of a multi-year capex number, with management saying capex in the next three years will be significantly higher than the past three years.
- Competitive dynamics in leading-edge foundry and advanced packaging, with management emphasizing technology, manufacturing and customer trust rather than financial or government support.
- AI demand visibility, agentic AI and CPU opportunities, with management describing AI demand as stronger than previously indicated and declining to give a specific CAGR number.
- Capacity planning and supply-demand gap, with management stating the gap is very big and demand expected to be strong through roughly 2029-2030, while acknowledging uncertainty about interim dips.
Risques
- Steep 2 nm ramp is expected to dilute gross margin by about 3-4 percentage points in the second half of 2026 and in the second half of the year.
- Overseas fab ramp is forecast to dilute gross margin by 2%-3% in early stages, widening to 3%-4% in later stages over the next several years.
- Consumer and price-sensitive end markets are challenged by rising component prices and macroeconomic uncertainties; mature-node demand outside power management IC and CMOS image sensor is not strong.
FY2026 Q12026-04-16
Conférences de résultats
Résumé IA
positiveTSMC reported Q1 2026 revenue of USD 35.9 billion, up 6.4% sequentially in US dollar terms and slightly ahead of guidance, driven by strong demand for leading-edge process technologies. Gross margin rose 3.9 percentage points sequentially to 66.2%, and operating margin improved 4.1 points to 58.1%; EPS was TWD 22.08 and ROE 40.5%. HPC increased 20% quarter over quarter to 61% of revenue, while smartphone declined 11% to 26%. For Q2 2026, TSMC guides revenue of USD 39.0-40.2 billion (about 10% sequential growth), gross margin of 65.5%-67.5% and operating margin of 56.5%-58.5%. Management maintained high conviction in the multiyear AI megatrend and now expects full-year 2026 revenue to grow above 30% in US dollar terms. The company expects 2026 capital budget toward the high end of the USD 52-56 billion range and is expanding N3 capacity with new fabs in Taiwan, Arizona and Japan.
Points clés
- AI-related demand remains extremely robust, with customers and cloud service providers giving a strongly positive outlook; TSMC now expects full-year 2026 revenue growth above 30% in US dollar terms.
- TSMC is adding N3 capacity: a new 3-nanometer fab in Tainan Science Park (volume production first half 2027), a second Arizona fab using 3-nanometer (volume production second half 2027) and a second Japan fab planned for 3-nanometer (volume production 2028).
- N2 entered high-volume manufacturing in Q4 2025 with good yield and is ramping at Hsinchu and Kaohsiung; initial N2 ramp is expected to dilute gross margin by 2%-3% for full-year 2026.
- N3 gross margin is expected to cross over to the corporate average in the second half of 2026.
- 2026 capital budget is expected toward the high end of the USD 52-56 billion range, citing robust HPC and AI demand and tight supply.
Faits financiers
- Q1 2026 revenue was USD 35.9 billion, up 6.4% sequentially, slightly ahead of guidance.
- Q1 2026 gross margin was 66.2%, up 3.9 percentage points sequentially; operating margin was 58.1%, up 4.1 points.
- Q1 2026 EPS was TWD 22.08 and ROE was 40.5%.
- Advanced technologies (7nm and below) accounted for 74% of wafer revenue; 3nm was 25%, 5nm 36% and 7nm 13%.
Perspectives
- Q2 2026 revenue guided to USD 39.0-40.2 billion, about 10% sequential and 32% year-over-year growth at the midpoint.
- Q2 2026 gross margin guided to 65.5%-67.5%; operating margin 56.5%-58.5%, based on a USD/TWD exchange rate assumption of 31.7.
- Q2 2026 tax rate expected around 20% due to accrual of tax on undistributed retained earnings; full-year tax rate expected between 17% and 18%.
- Full-year 2026 revenue expected to grow above 30% in US dollar terms; 2026 capital budget expected toward the high end of the USD 52-56 billion range.
Thèmes Q&A
- N3 supply tightness and capacity expansion: analysts probed what applications drive multiyear N3 demand and whether fully depreciated equipment could lift N3 margins further.
- Competition, including Intel and customer in-house or alternative foundry initiatives: management said there are no shortcuts in foundry and that capacity tightness, not other factors, is the issue, while noting it works with customers on next-generation products.
- Long-term CapEx and capital intensity: management said it has no specific multiyear CapEx dollar figure but expects CapEx in the next three years to be significantly higher than the past three years' USD 101 billion, while not expecting a sudden surge in capital intensity.
- Advanced packaging and larger reticle sizes: management cited large-reticle CoWoS as the main approach today, with CoPoS in a pilot line expected to reach production in a couple of years, alongside SoIC and System on Wafer.
Risques
- Rising component and memory prices are affecting price-sensitive consumer segments such as PC and smartphone; management described the market as slightly softer while high-end smartphones continue to do better.
- Recent Middle East situation may raise prices for certain chemicals and gases, with potential impact on profitability that management said is too early to quantify; TSMC does not expect near-term disruption to material or energy supply.
- Overseas fab ramp-up is expected to dilute gross margin by 2%-3% in the early stages and 3%-4% in later stages over the next several years; N2 ramp dilutes gross margin by 2%-3% for full-year 2026.
FY2025 Q42026-01-15
Conférences de résultats
Résumé IA
positiveTSMC reported fourth quarter 2025 revenue up 5.7% sequentially in NT dollars and 1.9% sequentially in USD terms, with gross margin rising 2.8 percentage points sequentially to 62.3% and operating margin at 54%. For full year 2025, revenue rose 35.9% in USD terms and 31.6% in NT terms, with gross margin of 59.9% and EPS of TWD 66.25. HPC accounted for 55% of Q4 revenue and 58% of full-year revenue; advanced technologies (7nm and below) were 77% of Q4 wafer revenue. Management guided Q1 2026 revenue of USD 34.6-35.8 billion, gross margin of 63%-65% and operating margin of 54%-56%. For 2026, TSMC expects full-year revenue growth close to 30% in USD terms and a capital budget of USD 52-56 billion. Management raised its AI accelerator revenue growth forecast to a mid-to-high 50s percent CAGR for 2024-2029 and overall long-term revenue growth to approach 25% CAGR. N2 entered high-volume manufacturing in Q4 2025, with N2P and A16 volume production scheduled for the second half of 2026.
Points clés
- 2025 revenue grew 35.9% in USD terms, outperforming Foundry 2.0 industry growth of 16%; TSMC forecasts Foundry 2.0 to grow 14% in 2026 and expects to outperform it.
- AI accelerator revenue was a high-teens percentage of total 2025 revenue; management raised its 2024-2029 AI accelerator CAGR forecast to mid-to-high 50s percent and overall long-term revenue growth to approach 25% CAGR.
- N2 entered high-volume manufacturing in Q4 2025 at Hsinchu and Kaohsiung with good yield; N2P and A16 volume production are scheduled for the second half of 2026.
- 2026 capital budget is USD 52-56 billion, with about 70%-80% for advanced process technologies, about 10% for specialty technologies and 10%-20% for advanced packaging, testing, mask making and others.
- Arizona expansion is accelerating: the second fab's high-volume manufacturing is now expected in the second half of 2027, the third fab is under construction, and TSMC has purchased a second large piece of land for a giga-fab cluster.
Faits financiers
- Q4 2025 revenue rose 5.7% sequentially in NT terms and 1.9% in USD terms; gross margin was 62.3%, operating margin 54%, EPS TWD 19.5 and ROE 38.8%.
- Full year 2025 revenue rose 35.9% in USD terms and 31.6% in NT terms; gross margin was 59.9%, operating margin 50.8%, EPS TWD 66.25 and ROE 35.4%.
- Full year 2025 operating cash flow was TWD 2.3 trillion and capital expenditures were TWD 1.3 trillion (USD 40.9 billion); free cash flow was TWD 1 trillion, up 15.2% from 2024.
- Advanced packaging revenue was about 8% of 2025 revenue and is expected to be slightly over 10% in 2026.
Perspectives
- Q1 2026 revenue guided to USD 34.6-35.8 billion, a 4% sequential increase or 38% year-over-year increase at the midpoint.
- Q1 2026 gross margin guided to 63%-65% and operating margin to 54%-56%, based on an exchange rate assumption of USD 1 to TWD 31.6.
- Full year 2026 revenue expected to increase close to 30% in USD terms; 2026 capital budget expected at USD 52-56 billion and depreciation expected to rise by a high-teens percentage year-over-year.
- 2026 effective tax rate expected at 17%-18%; overseas fab ramp is expected to dilute gross margin by 2%-3% in early stages and 3%-4% in later stages, and the initial N2 ramp is expected to dilute gross margin by 2%-3% for full year 2026.
Thèmes Q&A
- Whether AI demand is real and sustainable amid bubble concerns; CEO cited discussions with cloud service providers and said AI is real and becoming part of daily life.
- Capacity tightness and expansion timing: management said new fabs take 2-3 years, 2026-2027 output gains will come mainly from productivity, and supply-demand balance is targeted for 2028-2029.
- Non-AI demand and memory price inflation: management expects minimal unit growth for PC and smartphone but limited impact on TSMC because it supplies mostly high-end products.
- Competition from Intel Foundry: CEO acknowledged a formidable competitor but cited 2-3 year technology development and 1-2 year ramp timelines and said TSMC is not afraid.
Risques
- Management flagged uncertainties from potential tariff policies and rising component prices, especially in consumer-related and price-sensitive segments.
- Gross margin faces dilution from overseas fab ramp-up (2%-3% early, 3%-4% later) and from the initial N2 ramp (2%-3% in 2026), plus foreign exchange uncertainty.
- Rising leading-node manufacturing costs: CapEx per 1,000 wafers per month is substantially higher for N2 than N3 and even higher for A14, alongside inflationary cost pressures.
FY2025 Q32025-10-16
Conférences de résultats
FY2025 Q22025-07-17
Conférences de résultats
Actualités de l'entreprise
Reuters, WSJ, Bloomberg et FT d'abord, dans la mesure où notre fournisseur les livre ; les autres éditeurs derrière le second filtre. Les titres renvoient vers l'éditeur.- TSMC Approves Up to $1 Billion Investment Plan in Anthropic, OpenAI
- Taiwan semiconductor industry group backs government review of nuclear power restart
- AI Demand Extends TSMC's Record Earnings Streak
- TSMC's third-quarter revenue surges to record, beating market forecast
- TSMC evaluates potential Texas investment, sources say
- Taiwan breaks ground on advanced packaging park anchored by TSMC
- MediaTek launches new mobile chip using TSMC's most advanced technology
- Taiwan's chip prowess is built on democracy and rule of law, president says
- Xiaomi launches new Xring chip, partners with TSMC for production, sources say
- SEC filing shows Softbank initiates stake in Capital One; sells 71.5% of its Taiwan Semi holdings
Données d’entreprise
Analyse de l’entreprise
Actualisé: 10 nov. 2026, 15:36 UTC
Données d’entreprise
Analyse de l’entreprise
Profil de l’entreprise
- Secteur
- Technology
- Industrie
- Semiconductors
- Direction générale
- Che Chia Wei
- Employés
- 76 907
- Date d’introduction
- 5 sept. 1994
- Pays
- TW
- Bourse
- Taiwan Stock Exchange
Facteurs de notation
- Rendement des capitauxi
- 5
- Rendement des actifsi
- 5
- Dette sur capitauxi
- 3
- Cours sur bénéficei
- 3
- Cours sur actif neti
- 1
Historique de capitalisation
Principaux fonds détenteurs
| Fonds | Poids | Actions détenues |
|---|---|---|
| 195980.KS | 13,24% | 520 Bn |
| 189400.KS | 1,67% | 16,8 Bn |
| 0050.TW | 58,85% | 617,5 M |
| VXUS | 4,24% | 359,7 M |
| VWO | 15,72% | 344 M |
| IEMG | 13,26% | 282,8 M |
| EIMI.L | 13,18% | 83 M |
| EIMU DE | 13,95% | 82,8 M |
| EMXC | 19,24% | 70,3 M |
| EEM | 15,06% | 62,2 M |
| VEU | 4,66% | 57,9 M |
| VWIGX | 7,5% | 40,7 M |
Historique des analystes
Les résultats des analystes qui suivent TSMC : recommandations, précision des objectifs de cours et réaction mesurée après leurs appels.
| 12 mois | 3 ans | |
|---|---|---|
| Recommandations | 0 | 0 |
| Analystes | 0 | 0 |
| Acheter / conserver / vendre | – | – |
| Relèvements / abaissements / initiations | 0 / 0 / 0 | 0 / 0 / 0 |
| Objectifs atteints / manqués | – | – |
| Rendement moyen après recommandation (TipRanks) | – | – |
| Meilleur / pire appel | – / – | – / – |
Après les appels à l'achat sur cette action : pas encore assez de cas mesurés
Données TipRanks · calculé le 5 nov. 2026 · 0 recommandations
Questions fréquentes
Où puis-je trader les contrats perpétuels TSMC ?
Les contrats perpétuels Taiwan Semiconductor Manufacturing (TWSE shares) (TSMC) se négocient sur 3 plateformes crypto, dont Ourbit, MEXC, Bitget. PerpEquities les compare selon le prix en direct, le taux de financement, l'open interest et la liquidité.
Puis-je trader TSMC 24h/24 ?
Oui. Contrairement à l'action sous-jacente, les perpétuels TSMC se négocient 24h/24 et 7j/7 — y compris le week-end et en dehors des heures de marché habituelles.
Quel est le taux de financement des perpétuels TSMC ?
En ce moment, le taux de funding du perp TSMC est de 0,0 % annualisé (médiane des plateformes), entre 0,0 % et 0,0 % sur 3 plateformes. Un taux positif signifie que les longs paient les shorts. PerpEquities affiche le taux en direct et son historique par plateforme.
Comment le prix du perp TSMC se compare-t-il à l'action Taiwan Semiconductor Manufacturing (TWSE shares) ?
Le prix mark médian du perp TSMC est de 72,5 $ contre un prix de référence de l'action de 72,5 $, soit une base de 0,0 %. Les perps suivent l'action via un prix d'indice ; l'écart se creuse quand le funding ou la liquidité divergent entre plateformes.
Qu'est-ce qu'un contrat perpétuel TSMC ?
Un perpétuel TSMC est un produit dérivé qui suit le cours de Taiwan Semiconductor Manufacturing (TWSE shares) sans date d'échéance. Il permet de prendre des positions longues ou courtes sur Taiwan Semiconductor Manufacturing (TWSE shares) sur les plateformes crypto, à toute heure.
Qu'est-ce que le perpétuel TSMCUSDT ?
TSMCUSDT est le symbole utilisé par la plupart des plateformes crypto pour le perpétuel Taiwan Semiconductor Manufacturing (TWSE shares) réglé en USDT (Tether). Il suit le cours de l'action TSMC via un indice, se négocie 24h/24 avec effet de levier et n'expire jamais.
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